CAE Analysis
CAE team is responsible for Thermal, CFD, Thermal Stress, Structure analysis of ECU. Aim is to improve reliability and reduce the risk of failure of ECUs.
Structure Analysis
- Housing stress & strain analysis
- Deformation analysis
- Vibration analysis
- Shock & drop test analysis
- Solder crack analysis
Thermal Analysis
- Thermal analysis of ECUs at component level, PCB level and system level
- CFD analysis to check fluid flow, pressure drop, and heat dissipation performance
- Thermal-stress simulation to check failure of the system due to stress generated by temperature
PCB Design
PCB Engineer co works with Global Klemove subsidiaries to make best in class PCBs. PCB is designed considering all Electrical, Mechanical, Thermal requirements.
Library Database Management
- Electronics parts creation and update
- Centralized Database management
- Parts Mechanical and electrical information